Rigid-flex PCB Capability
No. Item Technical Data
1 Layer Count 2~16Layers
2 Min. Line Width/Space 18um(finish Cu): 3.5/3.5mil
35um(finish Cu): 4/4mil
3 Min Space Between Coverlay Opening 0.2mm
4 Edge of Coverlay Opening to Trace 0.20mm(preferred)
5 Min Space between coverlay and solder pad 0.15mm
6 Polyimide Films 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils(100µ), 5 mils(125µ) as custmer requested
7 Thermabond Adhesive Acrylic/Modified Acrylic, Modified Epoxy, Polyimide
8 Copper Foils (RA or ED) 1/4oz to 3oz
9 FR-4 in Multi-layer Flex Circuits Laminated to flex circuit to create rigid flex boards, typically with vias
10 Stiffeners Polyimide, Rigid FR4, PSA, metal, or customer requested
11 Solder Resist Coverlay, LPI
12 Min. Finished Hole size 0.2mm
13 Max. Finished Hole size 6.30mm
14 Hole tolerance ±0.05mm
15 Min.space between holes 0.15mm
16 Minimum conductor edge to outline edge ≥0.1mm
17 Minimum space between coverlay and conductor ± 0.15mm
18 Hole to outline edge ≥ 0.10mm
19 Tooling tolerance Knife(Soft) tooling ± 0.25mm
Steel(Hard) tooling ± 0.05mm
CNC drill/rout ± 0.10mm
20 Maximum Layer to Layer Mis-registration ± 0.10mm
21 Copper Plated Thickness (PTH only) 8~15um;20~30um;30~70um(special)
22 Surface Finish Immersion Gold, HASL, Lead free HASL, Plating Hard Gold, OSP