Multilayer PCB consists of multiple conductive copper layers separated by insulating layers, commonly configured with 4, 6, 8 layers and so on. These layers are bonded together using heat and adhesive to form a single, integrated board. The inner layers are made of a substrate material known as the core, and the insulating layers are often referred to as prepreg. Prepreg is a glass-reinforced epoxy material impregnated with resin, and it facilitates the bonding of copper layers. Connections between outer and inner layers are established via plated through holes (PTH) and vias. Multilayer PCB introduces the lamination process, which is where we actually creates the composite PCB from layers of circuitry in a lamination press under high pressure and heat. After pressing, multilayer PCB production is treated almost the same as a traditional double-sided PCB.