Focus on quick turnaround prototype, small to medium PCB manufacturing since 2010.
Our value-added services are designed to enhance your experience and provide additional benefits beyond our core offerings. From quality guarantees to personalized support, we are committed to going the extra mile to ensure your complete satisfaction.
Ensure the PCB design meets manufacturability criteria to identify potential issues affecting efficiency, quality, and costs.
For prototypes, small batches, and applications where speed is crucial, our quickturn services can significantly reduce your lead time from design to finished product.
High Mix Low Volume PCB production, offering a wide variety of PCBs in small quantities, tailored to meet your specific needs.
Analyzing and recreating the layout and function of a PCB from real PCB sample to understand its design, components, and functionality.
| No. | Item | Feature | Standard | Advanced |
|---|---|---|---|---|
| 1 | Layer Count | Min~Max | 1~16L | 48L(Max.) |
| 2 | Material | Types | FR-4, Aluminum/ Copper-base, Rogers | FR-4(Halogen-free), Arlon |
| 3 | Panel Size | Max | 508 x 610 mm(20”x 24”) | 508 x 1500 mm(20” x 34”) |
| 4 | Finished Thickness | Min~max | 0.2~5.0mm(0.005~0.126”) | 0.2~6.5mm(0.005~0.165”) |
| 5 | Trace Width/ Space | Inner/ Outer layer | 3/3mils(0.075/0.075mm) | 2/2mils(0.05/0.05mm) |
| 6 | Mechanical Drilling | Min | 0.008”(0.20mm) | 0.006”(0.15mm) |
| 7 | Mechanical Drilling | Max | 0.197”(5.0mm) | 0.256”(6.5mm) |
| 8 | Laser Drilling | Min | 0.006”(0.15mm) | 0.004”(0.10mm) |
| 9 | Aspect Ratio | Max | 12:1 | 20:1 |
| 10 | Copper Thickness | Min~max | 0.5~6 OZ | 20 OZ(max) |
| 11 | Solder Mask | Color | Glossy/Matt Green, white, black, red, blue | Yellow, pink, purple |
| 12 | Silkscreen | Color | White, black | / |
| 13 | Surface Finish | Types | HASL, Immersion Gold/ Tin/ Silver, Plating hard Gold, OSP | ENEPIG |
| 14 | Routing | Bit diameter | 0.093”, 0.062”, 0.031” | 0.021” |
| 15 | Profile | Tolerance | ±0.006”(0.15mm) | ±0.004”(0.10mm) |
| 16 | V-scoring | Angle | 30° | 20°/ 45°/ 60° |
| 17 | Plating Hard Gold | Thickness | 0.032”(0.8um) typical | 0.050”(max) |
| 18 | Special Processes | / | Carbon Ink, Peelable Mask, depth controll milling | / |
Multilayer PCB manufacturing involves complex processes to create high-density interconnections. Advanced techniques like lamination, etching, and plating are utilized to produce durable, reliable circuit boards that power modern electronics.
Multi-layer PCB leads in both market share and revenue, reflecting industry trends toward more complex, high-performance electronics. The increasing demand for consumer electronics, IoT devices, and automotive applications continues to boost the multi-layer PCB market significantly.
In-depth and comprehensive overview of PCB industry standards and best practices required for ensuring quality assurance and consistency across all production processes.
