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The First Step of PCB Manufacturing – Engineering Guide

June 10, 2025 No Comments

Lead-free HASL (Hot Air Solder Leveling) and ENIG (Electroless Nickel Immersion Gold) are two common PCB surface finishes. Lead-free HASL offers good solderability and is cost-effective but can result in uneven surfaces and is less suitable for fine-pitch components. ENIG, on the other hand, provides a very flat surface, excellent for fine-pitch and BGA components, along with superior corrosion resistance and long shelf life, though it is more expensive. Choice between them depends on application requirements for reliability, planarity, and cost. Lead-free HASL Lead-free HASL (Hot Air Solder Leveling) is a surface finish process used in the manufacturing of printed circuit boards

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FPC Laminates – Adhesive vs. Adhesiveless

June 9, 2025 No Comments

Lead-free HASL (Hot Air Solder Leveling) and ENIG (Electroless Nickel Immersion Gold) are two common PCB surface finishes. Lead-free HASL offers good solderability and is cost-effective but can result in uneven surfaces and is less suitable for fine-pitch components. ENIG, on the other hand, provides a very flat surface, excellent for fine-pitch and BGA components, along with superior corrosion resistance and long shelf life, though it is more expensive. Choice between them depends on application requirements for reliability, planarity, and cost. Lead-free HASL Lead-free HASL (Hot Air Solder Leveling) is a surface finish process used in the manufacturing of printed circuit boards

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Laminated Structure of Multilayer PCBs

June 9, 2025 No Comments

Laminated Structure of Multilayer PCBs Lead-free HASL (Hot Air Solder Leveling) and ENIG (Electroless Nickel Immersion Gold) are two common PCB surface finishes. Lead-free HASL offers good solderability and is cost-effective but can result in uneven surfaces and is less suitable for fine-pitch components. ENIG, on the other hand, provides a very flat surface, excellent for fine-pitch and BGA components, along with superior corrosion resistance and long shelf life, though it is more expensive. Choice between them depends on application requirements for reliability, planarity, and cost. Lead-free HASL Lead-free HASL (Hot Air Solder Leveling) is a surface finish process used in the

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DFM Checklist

June 9, 2025 No Comments

Lead-free HASL (Hot Air Solder Leveling) and ENIG (Electroless Nickel Immersion Gold) are two common PCB surface finishes. Lead-free HASL offers good solderability and is cost-effective but can result in uneven surfaces and is less suitable for fine-pitch components. ENIG, on the other hand, provides a very flat surface, excellent for fine-pitch and BGA components, along with superior corrosion resistance and long shelf life, though it is more expensive. Choice between them depends on application requirements for reliability, planarity, and cost. Lead-free HASL Lead-free HASL (Hot Air Solder Leveling) is a surface finish process used in the manufacturing of printed circuit boards

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HDI PCB Material Selection Guide

June 3, 2025 No Comments

HDI PCB Material Selection Guide HDI PCB Key Features High-Density Interconnect (HDI) PCBs are advanced circuit boards designed for complex, high-density electronic assemblies. The key features of HDI PCBs include: 1. Microvias and Laser Drilling HDI PCBs utilize microvias—small-diameter vias typically drilled with laser technology—to create interlayer connections. These microvias are often only a few mils in diameter and allow for high interconnection density while preserving space for routing. 2. Blind and Buried Vias HDI technology incorporates blind vias (connecting outer layers to internal layers without passing through the entire PCB) and buried vias (restricted to internal layers), which enable more routing

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