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Expert PCB Assembly Services in China – Quality, Speed, and Reliability You Can Trust.
Our value-added services are designed to enhance your experience and provide additional benefits beyond our core offerings. From quality guarantees to personalized support, we are committed to going the extra mile to ensure your complete satisfaction.
Free DFM analysis to Ensure the PCB design is optimized for assembly, reducing errors and improving yield rates.
Support both Surface Mount Technology (SMT) and Through-Hole Technology (THT) for complex or hybrid PCB designs.
Expedited assembly services to meet tight deadlines, ideal for prototyping or urgent production needs.
Comprehensive end-to-end service covering PCB fabrication, component sourcing, assembly, and testing, providing a seamless experience for customers.
No. | Item | Feature | Standard | Advanced |
---|---|---|---|---|
1 | Layer Count | Min~Max | 1~16L | 48 L(Max.) |
2 | Material | Types | FR-4, Aluminum/ Copper-base, Rogers | FR-4(Halogen-free), Arlon |
3 | Panel Size | Max | 508 x 610 mm(20”x 24”) | 508 x 1500 mm(20” x 34”) |
4 | Finished Thickness | Min~max | 0.2~5.0mm(0.005~0.126”) | 0.2~6.5mm(0.005~0.165”) |
5 | Trace Width/ Space | Inner/ Outer layer | 3/3mils(0.075/0.075mm) | 2/2mils(0.05/0.05mm) |
6 | Mechanical Drilling | Min | 0.008”(0.20mm) | 0.006”(0.15mm) |
7 | Mechanical Drilling | Max | 0.197”(5.0mm) | 0.256”(6.5mm) |
8 | Laser Drilling | Min | 0.006”(0.15mm) | 0.004”(0.10mm) |
9 | Aspect Ratio | Max | 12:1 | 20:1 |
10 | Copper Thickness | Min~max | 0.5~6 OZ | 20 OZ(max) |
11 | Solder Mask | Color | Glossy/Matt Green, white, black, red, blue | Yellow, pink, purple |
12 | Silkscreen | Color | White, black | / |
13 | Surface Finish | Types | HASL, Immersion Gold/ Tin/ Silver, Plating hard Gold, OSP | ENEPIG |
14 | Routing | Bit diameter | 0.093”, 0.062”, 0.031” | 0.021” |
15 | Profile | Tolerance | ±0.006”(0.15mm) | ±0.004”(0.10mm) |
16 | V-scoring | Angle | 30° | 20°/ 45°/ 60° |
17 | Plating Hard Gold | Thickness | 0.032”(0.8um) typical | 0.050”(max) |
18 | Special Processes | / | Carbon Ink, Peelable Mask, depth controll milling | / |
PCB Loader | Solder Paste Printing | 3D SPI | Fuji NXT III | Fuji AIMEX III | Fuji XPF | Reflow Oven | AOI | 3D X-Ray |
---|---|---|---|---|---|---|---|---|
The first automated step, where boards are fed into the assembly line, ensuring consistent orientation and spacing for downstream processes. | High precision high stability solder paste printing, Printing accuracy ±0.025mm, Screen frame size: 470*380-900*900mm, PCB size: 50*50 ~ 600*610mm PCB thickness: 0.4-5mm. | 3D white light PSLM PMP, Bad detection types: missing printing, less tin, more tin, even tin, deviation, bad shape, surface pollution Maximum PCB size: 510 x 505mm. | Fuji latest generation of high-speed mounting modules. Single module component mounting capacity up to 37500CPH. Can mount 01005, 0201, 0402 and other devices. Can mount the next generation of 03015 ultra-precision devices. | Minimum mouting package: 03015, Number of stickers: 35000CPH, PCB size: 48*48mm-774*710mm, Chip precision: minimum ±0.034mm, IC chip precision: ±0.025mm. | Minimum mouting package: 01005, Chip/0.35mm BGA, PCB thickness: 0.3-6.5mm, PCB size: 50*50mm ~ 686 x 508mm, Chip precision: minimum ±0.04mm, IC chip precision: ±0.03mm. | 12 temperature heating zones, Heating time: around 30 minutes, PCB temperature distribution deviation: < 1.5℃, Maximum width of PCB: 610mm. | PCB size: 630 x 520mm, PCB thickness: 0.5 ~ 5.0mm, PCB component height: upper:35mm, lower: 110mm, PCB warping degree: bending less than 3mm is acceptable. | Maximum sample size: 800 x 500mm, Number of PCT production photos: 360, Number of photos produced by ACT:1500-1800, Resolution: 0.75um minimum. |
The PCB assembly process is a systematic sequence that transforms a bare PCB into a functional electronic device. It involves multiple stages utilizing specialized equipment and quality controls, ensuring reliable and efficient integration of components according to design specifications.
Initial inspection and verification of received materials, including bare PCBs and components, before they enter the assembly process, to ensure that materials comply with customer requirements and specifications.
Baking the bare PCBs and the moisture-sensitive components(such as certain ICs, BGAs, and plastic-packaged components) prior to assembly.
Prepare for the inner layer DFR(Dry Film Resist) lamination. To increase DFR adhesion, etch the surface of copper foils by jet-scrubber, buffbrushing.
Laminate Dry Film on cores. D/F is used as a photosensitive material forphotolithography.
Expose light onto the D/F.LDI (Laser Direct Imaging),which doesn't require mask application,is analternative solution.
Same as the following. Developing the photoresist; Etching away unwanted copper; Stripping the remaining resist to reveal the circuit pattern.
Etch the surface of copper surface to ensure adhesion of coppe and Prepreg.
Laminate Dry Film on cores. D/F is used as a photosensitive material forphotolithography.
Heat the laminated layers under pressure in a vacuum melt Prepreg by heat to multilayer PCB formation. Other processes by the following will be the same as a double-sided PCB.
Drill on board to form through holes.
Remove the smear and resin residues left in the drilled holes, to ensure good electrical connectivity and improve the copper plating quality.
Electroless Copper Plating, a thin layer of copper is deposited on the hole walls through a chemical process, making them conductive.
Electroplating, the thin copper layer is further reinforced with additional copper through electroplating, ensuring robust andreliable electrical connections.
Prepare for the next step, D/F lamination. To increase dry film adhesion, etch the surface of copper foils by jet-scrubber,buff brushing.
Laminate Dry Film on copper foils. D/F is used as a photosensitive material for photolithography.
Apply masks(films) on D/F and expose light onto the surface of copper foils. Currently, we use both ways, D/Fand LDI(Laser Direct Imaging), which doesn't require mask application.
Developing the photoresist; Etching away unwanted copper; Stripping the remaining resist to reveal the circuit pattern.
Use AOI for outer layer inspection, to check for defects such as scratches, misalignments, and incomplete etching, ensuring the final board meets the required specification.
In-depth and comprehensive overview of PCB industry standards and best practices required for ensuring quality assurance and consistency across all production processes.