Basic PCB with copper layer on one side
Circuits on both sides, interconnected
Stacked-layer PCB for complex electronics
High density PCB with laser drilling microvias
PCB with thick copper layers for high current
PCB optimized for high-frequency signal integrity
Robust PCB for modular system connectivity
PCB with metal core for improved heat dissipation
Thin, bendable PCB for flexible electronics
PCB combining both rigid and flexible layers
FR-4 PCB with depth controlled milling technology
PCB for high-efficiency MiniLED displays
Eco-friendly PCB with halogen-free materials
Durable PCB made by Polyimide material
High-performance, miniaturized base for IC
Embedded parts in PCB for space-saving integration
Passive component that limits electrical current flow
Stores and releases electrical energy in circuits
storing energy through magnetic fields
Amplify or switch electronic signals
Convert voltages and isolate circuits electrically
Energy-efficient, long-lasting light source
Compact components for complex electronic functions
Controls the flow of electricity
Join electrical circuits for signal transmission
Protects circuits from overloads and damage
Materials that control electrical current flow
Stores and provides electrical energy
Transmission and reception of radio frequency signals
Devices with electrical and mechanical components
Protect and control electrical power circuits
Conduct and connect electrical power and signals
Laser-cut stencil for accurate components placement
Surface Mount assembly with Reflow soldering
Through-hole parts using DIP and wave soldering
Both SMT and DIP components on one board
PCB assembly without the use of lead solder
Programming integrated circuits for specific functions
Repair of Ball Grid Array (BGA) chips
Protective coating to against moisture and contaminants
Process of shaping materials by injecting into molds
Testing to verify product's function and performance
Soldering pre-made cables and wires on board
Test to simulate long-term wear and performance
Electronic component integration into enclosures
Electronic Manufacturing Services
Customer sources some parts and we handle the rest
Complete assembly service from design to final product
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Comprehensive specifications and technical details
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HDI PCB Key Features High-Density Interconnect (HDI) PCBs are advanced circuit boards designed for complex, high-density electronic assemblies. The key features of HDI PCBs include: 1. Microvias and
Lead-free HASL (Hot Air Solder Leveling) and ENIG (Electroless Nickel Immersion Gold) are two common PCB surface finishes. Lead-free HASL offers good solderability and is cost-effective but can
Reflow soldering temperature setting is a precise and critical process in electronics manufacturing, as it determines the quality and reliability of solder joints by carefully controlling the heating
Laminated Structure of Multilayer PCBs Lead-free HASL (Hot Air Solder Leveling) and ENIG (Electroless Nickel Immersion Gold) are two common PCB surface finishes. Lead-free HASL offers good solderability
HDI PCB Material Selection Guide HDI PCB Key Features High-Density Interconnect (HDI) PCBs are advanced circuit boards designed for complex, high-density electronic assemblies. The key features of HDI
