Surface-Mount Technology(SMT) refers to solder the electronic components directly onto the surface of the Printed Circuit Board. Components may be populated on one side (single-sided) or both sides (double-sided) of the board. This technology allows for more compact, efficient designs compared to traditional through-hole manufacturing methods, enabling the creation of smaller, more complex electronic devices. It’s widely used in the electronics industry for mass production and in devices where space and weight are critical factors. As of it is for now, It is the mainstream of the electronic assembly industry.  

The advantages of surface-mount technology include smaller components and greater board densities. The large holes have been replaced by small vias for signal conduction between outside and internal layers. Finer traces and reduced component heights also contribute to increased circuit board miniaturization and functionality.